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Wet Bench Division
Core Differences: Zhijing Low‑Oxygen Wet Process Workstation vs. Conventional Wet Process Equipment

I. Oxygen Control Capability: From Passive Protection to Active Closed Loop Control

l Conventional wet process equipment: No dedicated oxygen control system; relies only on simple ventilation with uncontrollable oxygen concentration. Wafers exposed to air are highly prone to oxidation, discoloration and defects.

l Zhijing Low Oxygen Workstation: Equipped with an overhead FFU intelligent nitrogen circulation system that delivers clean nitrogen in vertical laminar flow to rapidly displace air and create a near oxygen free process environment. Built in real time O₂ concentration detector with automatic voice notification upon reaching the target; fully enclosed low oxygen transfer throughout the process drastically shortens the oxidation window, eliminating oxidation related scrappage at the source.

 


II. Cleanliness and Protection: From Prone to Contamination to Dual Zero Clearing

l Conventional wet process equipment: Weak filtration and poor sealing; susceptible to particle and watermark contamination. Acid fumes easily escape, endangering the workshop and personnel safety.

l Zhijing Low Oxygen Workstation: Dual purification via FFU + high efficiency filters to maintain stable Class 100 cleanliness. Vertical unidirectional airflow removes microparticles and exhaust gas. Fully sealed structure + powerful air extraction achieve zero acid fume leakage. Realtime temperature and humidity monitoring prevents condensation and ensures surface cleanliness.

III. Material and Safety: From Corrosion Prone to Triple Protection

l Conventional wet process equipment: Uses ordinary anti-corrosion materials with low resistance to strong acids and alkalis, prone to aging and leakage; incomplete safety alarms.

l Zhijing Low Oxygen Workstation: Constructed with Grade 5/10 PP plates + PVDF/PTFE high-corrosion resistant materials, resistant to highly corrosive chemicals such as HF and HCl. Standard intelligent liquid leakage alarm (voice + threecolor indicator) for precise leakage location, paired with a waste liquid recovery system to prevent spread. Standardized process tank design adapts to demanding wet process requirements.

IV. Intelligence and Operation: From Manual Cumbersome to Contactless High Efficiency

l Conventional wet process equipment: Relies on manual control panels; inconvenient glove box operation in cleanrooms; slow fault response; no intelligent interlocking.

l Zhijing Low Oxygen Workstation: AI voice intelligent system enables contactless control of air volume, nitrogen charging, ventilation and lighting. Intelligent voice alarms cover FFU failure, abnormal oxygen content and liquid leakage. Safety interlocks (cannot start with door open + pressure differential monitoring); multi terminal remote linkage and data traceability.

V. Adaptation and Deployment: From Fixed Single to Modular Flexibility

l Conventional wet process equipment: Fixed dimensions, single station, limited application scenarios; cumbersome assembly, large footprint and complex operation and maintenance.

l Zhijing Low Oxygen Workstation: Modular standard design compatible with 8/12 inch wafer lines; flexible station combination for acid tanks, rinse tanks and workstations. All in one integration enables efficient installation, small footprint and simple O&M, quickly matching diverse scenarios including cleaning, etching, photoresist stripping and more.

 

The above information about the Zhijing Low Oxygen Wet Process Workstation is provided by Hualinkena (Jiangsu) Semiconductor Equipment Co., Ltd. The Hualinkena Zhijing LowOxygen Wet Process Workstation is a dedicated semiconductor wet process equipment integrating low,oxygen anti,oxidation, Class 100 cleanliness, high corrosion resistance, intelligent safety, modularity and full,scene adaptation. It thoroughly solves the four major pain points of traditional equipment: oxidation, contamination, corrosion and leakage, providing stable and reliable wet process support for high end manufacturing such as chips, optoelectronic devices, power devices, MEMS and advanced packaging.