Email:xu@hlkncse.com
Tel:13358064333
Wet Bench Division
Oxygen Control in Semiconductor Wet Processes

Oxidation, contamination, corrosion and acid fume leakage are four critical issues that severely impact yield in the trial production, pilot production and advanced device wet processes of semiconductor wafers. Wafers are prone to rapid oxidation and defect formation after etching. Conventional wet processing equipment fails to simultaneously deliver low-oxygen conditions, high cleanliness, corrosion resistance and operational safety, resulting in batch scrapping, rising costs and persistent production line risks.


Replacing or upgrading to low-oxygen wet workstations is the most direct and effective solution for enterprises to address wafer oxidation.


As a professional manufacturer dedicated to the R&D and production of semiconductor equipment, Hualin KeNa (Jiangsu) Semiconductor Equipment Co., Ltd. has launched the Intelligent Low-Oxygen Wet Workstation. The oxygen control mechanisms of this equipment are detailed as follows:


First, the workstation is equipped with an overhead FFU intelligent nitrogen circulation system. Purified nitrogen is delivered vertically in laminar flow to the operating area, rapidly displacing oxygen-containing air to create an almost oxygen-free processing environment. The reactive silicon on etched wafer surfaces readily reacts with oxygen to form oxidative defects, while wet processes demand extremely high cleanliness — a combination conventional equipment cannot achieve. This design eliminates oxidation triggers from the ambient environment and maintains Class 100 cleanroom standards, preventing particle contamination and acid fume dispersion, thereby reducing scrap rates and production costs.



Second, a built-in real-time oxygen concentration monitor is installed inside the equipment. It triggers an automatic voice prompt once the oxygen level reaches the standard, with visualized monitoring available. Given the stringent oxygen requirements for semiconductor wet processes, the lack of precise monitoring in ordinary equipment often leads to misjudgments and unstable processes. This system enables 24/7 dynamic oxygen monitoring and abnormal early warnings, eliminating empirical errors, sustaining a stable low-oxygen atmosphere, improving operational efficiency and complying with R&D and mass production specifications.


Third, wafers are transferred in a fully enclosed low-oxygen environment from loading to unloading, which greatly shortens the oxidation window. Etched wafers are highly susceptible to oxidation during this critical period, and open material handling on conventional equipment exposes wafers to ambient air and contamination. The fully enclosed transfer thoroughly isolates outside air, effectively preventing oxidation and contamination. It ensures consistent process stability, improves device yield and reliability, and meets the rigorous requirements of third-generation semiconductor manufacturing.


In addition, Hualin KeNa Intelligent Low-Oxygen Wet Workstation features a fully sealed protective structure that completely eliminates contamination and acid fume leakage, making it well-suited for wet processes involving strong acids and alkalis. It is also fitted with an AI voice intelligent control system to support contactless operation in cleanrooms, further boosting overall work efficiency and operational convenience.