Universal Wet Process Platform – Oxygen-Free Vacuum Surface Treatment Station

In the field of high-precision oxygen-free vacuum surface treatment equipment, Hualin Kena continuously optimizes solutions targeting industry pain points. The self-developed oxygen-free vacuum surface treatment workstation integrates ≤10 ppm oxygen control, vacuum etching and AI intelligence technologies. It provides stable and reliable wet process support for lab trials, pilot lines and R&D production lines, helping industries including semiconductors, optics, medical devices and new energy improve process stability and product yield.

Configuration of Semiconductor Intelligent Fume Hood Wet Process System

Upgraded from conventional laboratory fume hoods, intelligent wet process workstations are engineered for highly corrosive and high-risk processes including semiconductor wet processing, acid etching and cleaning. Built around modular construction, full-range safety interlocks, precise parameter control and intelligent voice-enabled operation & maintenance, the equipment fully complies with SEMI standards, cleanroom specifications and actual production requirements. It sets new benchmarks for semiconductor wet-process ventilation equipment via quantifiable performance indicators.

Core Differences: Zhijing Low‑Oxygen Wet Process Workstation vs. Conventional Wet Process Equipment

Conventional wet process equipment: No dedicated oxygen control system; relies only on simple ventilation with uncontrollable oxygen concentration. Wafers exposed to air are highly prone to oxidation, discoloration and defects.

Oxygen Control in Semiconductor Wet Processes

Oxidation, contamination, corrosion and acid fume leakage are four critical issues that severely impact yield in the trial production, pilot production and advanced device wet processes of semiconductor wafers. Wafers are prone to rapid oxidation and defect formation after etching. Conventional wet processing equipment fails to simultaneously deliver low-oxygen conditions, high cleanliness, corrosion resistance and operational safety, resulting in batch scrapping, rising costs and persistent production line risks.

Wet Bench (Low-Oxygen Type) Wet Process Station – Key Technical Parameters & Performance Indicators

In semiconductor and general semiconductor wet processes, low-oxygen control, cleanliness, corrosion resistance, and safe operation are the core factors determining process stability and product yield.