Core Differences: Zhijing Low‑Oxygen Wet Process Workstation vs. Conventional Wet Process Equipment

Conventional wet process equipment: No dedicated oxygen control system; relies only on simple ventilation with uncontrollable oxygen concentration. Wafers exposed to air are highly prone to oxidation, discoloration and defects.

Oxygen Control in Semiconductor Wet Processes

Oxidation, contamination, corrosion and acid fume leakage are four critical issues that severely impact yield in the trial production, pilot production and advanced device wet processes of semiconductor wafers. Wafers are prone to rapid oxidation and defect formation after etching. Conventional wet processing equipment fails to simultaneously deliver low-oxygen conditions, high cleanliness, corrosion resistance and operational safety, resulting in batch scrapping, rising costs and persistent production line risks.

Wet Bench (Low-Oxygen Type) Wet Process Station – Key Technical Parameters & Performance Indicators

In semiconductor and general semiconductor wet processes, low-oxygen control, cleanliness, corrosion resistance, and safe operation are the core factors determining process stability and product yield.

Solutions to Wafer Oxidation and Acid Mist Leakage

With continuous breakthroughs in advanced processes and the large-scale rise of the third-generation semiconductor industry, high anti-oxidation performance, ultra-high cleanliness, strong corrosion resistance, and full-domain safety control have become rigid demands in wet processing for the general semiconductor industry.

Core Technical Parameters of Intelligent Fume Hood | Intelligent Wet Process Workstation

Fume hoods are essential laboratory equipment. Traditional fume hoods have single functions and fixed operation modes, running passively after installation and startup. Intelligent fume hoods are upgraded versions of traditional ones.