Study on aluminum corrosion in single wafer wet cleaning process

In the manufacturing process of integrated circuits, cleaning of particles, metal contamination, natural oxide film on the wafer surface and by-products produced in the production process is one of the most used process steps, and the cleaning effect seriously affects the performance of integrated circuits and the quality and reliability of devices [1-3].

Study on valve port flow characteristics of ultra-pure water diaphragm valve under different driving modes

Diaphragm valves not only have simple structure, good sealing and small pressure loss, but also have the characteristics of corrosion resistance, impact resistance and wear resistance that traditional hydraulic valves do not have, so they are widely used in ultra-pure media fluid control systems (such as information technology, biomedical and new energy technology, etc.).

Development of wafer wet etching cleaning process and flow control

Moore's Law continues to accept new challenges, and wet etching cleaning equipment is also improving. Existing wet cleaning equipment can be divided into batch cleaning equipment (Bench Clean) according to the cleaning method, as shown in Figure 1 (a), and single piece cleaning equipment (Single Wafer Clean), as shown in Figure 1 (b).

Wet Cleaning Technology An In-depth Examination

Wet cleaning, also known as wet etching or chemical cleaning, is a process used in numerous industries to remove surface contamination, unwanted particles, or residue.