Wafer Material:   Si,SiC,GaN,GaAs, sapphire, glass

Mode of Operation：Manual, Fully automatic, Semi-automatic

Wafer Lots:    25,50

Wafer Size:     50mm up to 200mm （Compatible mode is available）

Treatment process:    dry into dry out, dry into wet out

Tank functions:     high pressure spray, circulation, filtration, heating, ultrasonic, CDR, drying

Chemical Solution:   SC1,SC2,APM,DHF,SPM,HPM

Drying system: IPA drying, Marangoni drying

Equipment stability: Metal adhesion: < 3E10 atmos/cm㎡

        Less than 10 particles ≥0.2μm

Security:

The equipment is equipped with leakage, emergency stop, liquid level, overtemperature, safety door opening, leakage, timeout and other protection and alarm devices to ensure the safety and reliability of the equipment

Applicable process：

Pre-cleaning,Post-CMP Cleaning,RCA Cleaning,,Pre-epi clean,De-glue cleaning,Pre- / Post- diffusion cleaning,Various cleaning process，Piranha cleaning，Pre-oxidation cleaning

RCA Cleaning : data of tank (Example):

De-glue cleaning - organic De-glue cleaning

data of tank (Example):

Organic cleaning machine - data of tank (Example):

*This product is non-standard equipment, non-standard equipment is customized according to the specific manufacturing needs of the enterprise, with higher production efficiency and more accurate control ability, can meet the changing production needs.

If you want to know more about our products, please click contact us ！

WhatsApp:17372890313

Email: XU@hlkncse.com

Tel:+86 13358064333