CSE and Taiwan Hongsu Technology signed a strategic cooperation agreement. Representatives from Hualincona, Hongsu Technology, Mitsubishi Electric, Hong Kong Applied Science and Technology Research Institute, Wenji Capital, and School of Microelectronics of Shanghai Jiao Tong University attended and witnessed the signing ceremony. According to the agreement, the two sides will actively promote cooperation in the field of semiconductor wet process equipment research and development, manufacturing, after-sales service support and other aspects based on the principle of "strong combination, complementary advantages, and win-win cooperation" to promote common development.

Figure 1 Contract Signing

At the signing ceremony, the two sides conducted friendly exchanges. As a high-quality supplier in the field of domestic wet process equipment, the business scope covers four series of dozens of models of products including wet cleaning, etching system, CDS system and tail gas treatment system, which are widely used in large-scale integrated circuits, power electronic devices, discrete devices, optoelectronic devices, MEMS and other fields. As the leading brand of semiconductor equipment manufacturing in Taiwan, Hongsu Technology Co., LTD., the signing of the contract with Hualincona Semiconductor is the starting point of friendly cooperation between the two sides, and we should take this opportunity to deepen cooperation areas from a long-term and strategic height, and increase the development, production and sales of new products of high-end equipment such as 8-inch and 12-inch single chip rotary cleaning equipment and electroplating equipment. Through close and efficient cooperation, release 1+1> 2 value-added benefits, and work together to explore new developments in the field of semiconductor equipment.