TGV etch, Also known as "Through-silicon-vias Etch", is a technology used in the field of semiconductor manufacturing for processing through-holes in silicon substrates. This technology is mainly used to make vertical through holes on a silicon substrate to achieve the interconnection between chips.

The TGV etch technology uses a chemical gas to react with a silicon substrate to remove the silicon material and form a through-hole. The technology has the characteristics of high precision and high efficiency, and can quickly produce a large number of through holes on the silicon substrate, and the control accuracy of the size and shape of the through holes is very high.

TGV etch technology is very important to improve the interconnection density and performance between chips. By creating through-holes on silicon substrates, chips on different layers can be connected to achieve higher speed and lower power transmission. In addition, TGV etch technology can be used to manufacture other types of vertical through-hole structures, such as through-holes for applications such as sensors, actuators and micromechanical structures.