Project Name: International Tender Announcement (1) for the Characteristic Process Production Line Construction Project of Shanghai Jita Semiconductor Co., Ltd.

Equipment:

Wafer Cleaning Machine (Front-end) - 1 unit

Grinder / Backside Thinning Machine - 1 unit

Bid Opening Time: 10:00, December 3, 2025

Tenderer: Shanghai Jita Semiconductor Co., Ltd.

Address: No. 600 Yunshui Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone

Contact Person: Ms. Gong