Post-CMP Clean refers to the cleaning performed after the chemical mechanical polishing (CMP) process. CMP is a commonly used semiconductor manufacturing technology used to flatten silicon wafers or other materials to make finer electronic devices.

Following the CMP process, Post-CMP Clean is usually required to remove residual contaminants and debris from the surfaces of silicon wafers or other materials. This cleaning process can include the use of chemical solutions or physical means to remove particles, metal ions, organic matter, and other pollutants from the surface to ensure that the manufactured electronics are of high quality and reliability.

It should be noted that Post-CMP Clean is a highly technology-intensive process that requires strict control of cleaning conditions and operating procedures to ensure cleaning effectiveness and surface quality. In addition, with the continuous development of semiconductor technology, the requirements for Post-CMP Clean technology are also increasing, and we need to constantly improve and improve the cleaning process and methods to adapt to the changing market demand and technology development trends.