The etching solution chemically reacts with the glass surface, causing the glass surface to be etched or corroded. Depending on the fluid composition and etching conditions used, the etching process may involve multiple chemical reactions such as ion exchange, redox, etc.

During the glass etching process, the etching liquid contacts the glass surface and solves and gradually removes some components of the glass surface through chemical action. This process usually requires a certain temperature and time to ensure that the etching solution can fully penetrate into the glass surface and undergo chemical reactions.

To control the depth and shape of etching, masks or lithography are often used to protect areas that do not require etching. The selection of etching fluid and control of etching conditions are important to obtain the desired etching effect.

In the semiconductor industry, glass etching is widely used to manufacture a variety of microelectronics devices and optical devices. For example, making integrated circuits, microprocessors, memory, and other devices requires multiple layers of wiring, while glass etching can be used to make through-holes and connect wires between different layers. In addition, glass etching is also used to manufacture photoelectric devices, optical fiber communication devices, etc.

It should be noted that the glass etching process requires precise control to ensure etching accuracy and consistency. At the same time, in order to prevent environmental pollution in the etching process, corresponding environmental protection measures need to be taken.