Project Name: Beijing Information Optoelectronic Chip Platform Construction Project

Bidding Equipment: 

Fully Automatic High-Frequency High-Temperature Chip-Level Probe Station, Fully Automatic High-Frequency High-Temperature Flip-Chip Probe Station, 2 units

Bid Opening Time: March 3, 2026, 10:00

Bidding Enterprise: Beijing Lingchuang Optoelectronics Co., Ltd.

Contact Person: Mr./Ms. Tian