International Tender Notice (1) for Beijing Information Optoelectronic Chip Platform Construction Project
Tender Project: Beijing Information Optoelectronic Chip Platform Construction Project
Tender Equipment: Displacement Talbot Lithography Machine: 1 unit
Bid Opening Time: December 23, 2025, 10:00
Tenderee: Beijing Lingchuang Optoelectronics Co., Ltd.
Address: Room 401-2, 4th Floor, Building 52, No. 2, Jingyuan North Street, Beijing Economic and Technological Development Area, Beijing
Contact Person: Teacher Tian