Project Name: Beijing Information Optoelectronic Chip Platform Construction Project

Tendered Equipment: Automatic Coating & Bonding Machine / Automatic Debonding Machine (2 units)

Bid Opening Time: 10:00 AM, December 16, 2025 (GMT+8)

Tenderee: Beijing Lingchuang Optoelectronics Co., Ltd.

Address: Room 401-2, 4th Floor, Building 52, No. 2 Jingyuan North Street, Beijing Economic and Technological Development Zone, Beijing

Contact Person: Teacher Tian