In the semiconductor chemical engineering field (e.g., the transportation of corrosive/high-purity media such as developer, etching solution, and cleaning fluid), the performance parameters of pumps directly affect process stability, medium purity, and equipment service life. Below are the core performance parameters and key industry application points, detailed in combination with the characteristics of semiconductor wet processes.
I. Basic Performance Parameters (Universal Core Indicators)
1. Flow Rate
Definition: The volume/mass of medium delivered per unit time (units: m³/h, L/min, kg/h).
Key Points for the Semiconductor Industry:
Wet cleaning and etching processes require precise flow control (e.g., ±1% error) to avoid wafer yield reduction caused by uneven medium concentration;
Developer transportation demands low flow pulsation (diaphragm pumps and magnetic drive pumps are preferred) to prevent distortion of developed patterns;
Typical scenarios: The flow rate of single-wafer cleaning equipment is usually 5–50 L/min, while that of batch cleaning equipment can reach 50–200 L/min.
2. Head
Definition: The vertical height a pump can lift the medium (unit: m), reflecting its ability to overcome pipeline resistance and achieve medium transportation.
Key Points for the Semiconductor Industry:
Pipelines often include filters, valves, nozzles and other components, so the effective head must be calculated (actual required head = pipeline resistance + vertical height difference);
Pipelines for corrosive media (e.g., HF etching solution) are mostly made of PTFE, with smooth inner walls, but a 10–20% head margin should be reserved to cope with pipeline wear after long-term use.
3. Pressure
Definition: The pressure generated at the pump outlet (units: MPa, bar), directly related to head (pressure = medium density × gravitational acceleration × head).
Key Points for the Semiconductor Industry:
High-pressure cleaning (e.g., megasonic cleaning) requires the pump outlet pressure to be ≥0.3 MPa to ensure the atomization effect of nozzles;
Closed pipeline systems (e.g., developer circulation) need to control the working pressure at 0.1–0.2 MPa to avoid medium leakage or pipeline rupture.
4. Power
Definition: The motor power driving the pump (unit: kW), divided into shaft power (power consumed by the pump shaft) and rated motor power (actual input power).
Key Points for the Semiconductor Industry:
High-efficiency and energy-saving motors (e.g., IE3 grade) are preferred to reduce the high energy consumption costs of semiconductor factories;
Pumps for transporting corrosive media need to be matched with explosion-proof motors (e.g., Ex d II BT4 grade) to avoid safety risks caused by volatile gases of the medium.
II. Industry-Specific Key Parameters for Semiconductors (Core Selection Basis)
1. Material Compatibility
Definition: The materials of pump body, impeller, seals and other components in contact with the medium must resist corrosion from semiconductor chemical media (acids, alkalis, organic solvents, high-purity reagents).
Mandatory Industry Requirements:
Core materials: PTFE (Polytetrafluoroethylene), PVDF (Polyvinylidene Fluoride), Hastelloy, Titanium alloy (Ti), to avoid metal ion contamination (e.g., Fe and Cu ions can cause wafer defects);
Seals: Made of FFKM (Perfluoroelastomer) or PTFE, ordinary rubber is prohibited (prone to corrosion and particle contamination).
2. Particle-Free Operation
Definition: The pump generates no or very few particles during operation (unit: ≤10 particles/mL, particle size ≥0.1 μm), meeting the ISO Class 5 (Class 100) cleanliness requirements of the semiconductor industry.
Key Design Features:
Sealless design (e.g., magnetic drive pumps) to avoid particle generation from shaft seal wear;
Smooth internal flow channels without dead corners to reduce medium residue and particle accumulation;
Pumps containing lubricating oil (e.g., gear pumps) are prohibited to prevent oil mist contamination of the medium.
3. Leakage Prevention
Definition: The leakage of medium during pump operation (unit: mL/h), divided into external leakage (leakage to the environment) and internal leakage (internal backflow of the pump).
Industry Standards:
External leakage: ≤0.1 mL/h (almost no leakage), magnetic drive pumps (sealless, zero external leakage) or diaphragm pumps (sealed chambers) are preferred;
Internal leakage: ≤5% of the rated flow to avoid affecting flow accuracy and medium utilization (e.g., expensive photoresist and developer).
4. High Purity Adaptation
Definition: The pump’s ability to control contamination of high-purity media (e.g., UPW ultrapure water, electronic-grade developer), meeting the requirements for transporting semiconductor-grade reagents.
Core Indicators:
Metal ion precipitation: ≤1 ppb (10⁻⁹ g/g) to avoid contamination of high-purity media;
Design for Steam-in-Place (SIP) or Clean-in-Place (CIP) to facilitate regular maintenance and maintain medium purity.
5. Cavitation Resistance
Definition: The pump’s ability to avoid bubble generation (cavitation) under low inlet pressure. Cavitation can cause flow fluctuations, pump vibration, and impeller damage due to bubble collapse.
Requirements for Semiconductor Scenarios:
Some media such as developer and etching solution have low boiling points (the boiling point of some organic solvents ≤80℃), so the pump’s Net Positive Suction Head Required (NPSHr) must be ≤2 m to ensure stable operation under low-temperature and low-pressure conditions.
6. Reliability & Service Life
Definition: The failure rate and service life of the pump during continuous operation (semiconductor factories usually run 24 hours a day).
Industry Requirements:
Mean Time Between Failures (MTBF) ≥8000 hours;
Service life of wearing parts (e.g., diaphragms, seals) ≥6 months to reduce downtime and maintenance costs.
III. Priority Ranking of Selection Parameters (Semiconductor Industry Practice)
Material compatibility (primary principle to avoid corrosion and contamination) → 2. Particle-free operation (core process requirement) → 3. Flow/pressure accuracy (process stability) → 4. Leakage prevention (safety and cost control) → 5. Power and energy consumption (long-term operating costs).
