International Tender Announcement (1) for the Procurement of Precision Silicon Wafer Grinding Equipment for Phase II of the Shandong Youyan Ais 12-Inch Silicon Wafer Industrialization Project for Integrated Circuits
Project Name: International Tender Announcement (1) for the Procurement of Precision Silicon Wafer Grinding Equipment for Phase II of the Shandong Youyan Ais 12-Inch Silicon Wafer Industrialization Project for Integrated Circuits
Equipment: Precision Silicon Wafer Grinding Equipment, 2 sets
Bid Opening Time: 09:30, December 3, 2025
Tenderer: Shandong Youyan Ais Semiconductor Materials Co., Ltd.
Address: No. 6839, Dongfanghong East Road, Tianqu New District, Dezhou City, Shandong Province
Contact Person: Lu Jinjun
