In the manufacturing process of integrated circuits, cleaning of particles, metal contamination, natural oxide film on the wafer surface and by-products produced in the production process is one of the most used process steps, and the cleaning effect seriously affects the performance of integrated circuits and the quality and reliability of devices [1-3]. With the different performance requirements of integrated circuits at different development stages, the cleaning treatment technology in the existing integrated circuit manufacturing process is also constantly updated [4].

Common wafer cleaning techniques include wet cleaning and dry cleaning. Wet cleaning generally uses inorganic chemical solvents with strong corrosion and oxidation, so that the impurity particles on the wafer surface react chemically with the solvent, generate gas or be dissolved from the wafer surface. Dry cleaning means that chemical solvents are not used in the cleaning process, such as gas phase dry cleaning technology and beam cleaning technology [5]. Due to the high cost of dry cleaning technology, it has been restricting its large-scale promotion and development; Wet cleaning technology is still the dominant cleaning process in semiconductor factories because of its simplicity and efficiency. In order to solve the problem of cross-contamination of wafers, the method of wafer cleaning has also evolved from multi-cell immersion cleaning in mass production to single wafer cleaning [1,6].

In the wet cleaning process, due to various factors such as environment, production equipment and process deviation, wafers will have various defects in production, such as various particles on the wafer surface, etching residues, organic residues, water marks and metal wire corrosion, etc., which will affect the realization of device performance to varying degrees [7]. Among them, aluminum corrosion is a fatal defect, which not only seriously affects the yield and reliability of the chip, but also affects the online yield of the integrated circuit manufacturing line. This paper aims to discuss the aluminum corrosion defects in the single wafer wet cleaning process, explore the influence of different process parameters on aluminum corrosion defects, so as to reduce the probability of product defects, improve product reliability, and reduce scrap rate and production costs.

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