CECOM (Beijing) Co., Ltd., entrusted by the Tenderer, is conducting international open competitive tendering for the following products and services. The announcement was published on the China International Tendering Networkon October 13, 2025. This tender follows the traditional tendering method, and eligible bidders are now invited to participate.

1. Tender Conditions

•Project Overview: 12-Inch Integrated Circuit Manufacturing Project

•Fund Availability: Funds have been fully secured.

•Readiness for Tendering: The project meets all prerequisites for tendering.

2. Tender Content

•Tender Project No.: 4197-2240HZHFC001/167

•Tender Project Name: Hangzhou Jihai Semiconductor Co., Ltd.'s 12-Inch Integrated Circuit Manufacturing Project

•Implementation Location: Zhejiang Province, China

•List of Tendered Products (Main Equipment):

Copper Electroplating Stock Solution and Additive Concentration Analysis Equipment – 1 Set

3. Bidder Qualification Requirements

•Qualifications/Performance: Bidders must be legal persons or other organizations that: (1) respond to this tender; (2) have purchased tender documents from the tendering agency; (3) meet all requirements in the tender documents; and (4) participate in the bidding competition. Bidders from the People’s Republic of China or countries/regions with normal trade relations with China are eligible. Bidders shall provide proof of relevant sales performance for identical equipment used in 12-inch semiconductor wafer mass production lines (details in the tender documents).

•Consortium Bids: Not accepted.

•Bid Without Tender Documents: Not allowed.

4. Acquisition of Tender Documents

•Start Date for Purchase: October 13, 2025

•End Date for Purchase: October 20, 2025

•Online Sales: No

•Purchase Method: On-site purchase only

•Purchase Location: Tender Document Sales Office, Block A, No. 17 Fuxing Road, Haidian District, Beijing

•Price: RMB 1,500 / USD 250 (per set; refer to the announcement for package-specific pricing)

•Purchase Hours: 9:00–11:30 AM and 1:00–4:30 PM (Beijing Time, excluding holidays)

5. Submission of Bid Documents

•Bid Deadline (Bid Opening Time): 10:00 AM, November 4, 2025

•Delivery Location for Bid Documents: CECOM Conference Room, Block A, No. 17 Fuxing Road, Haidian District, Beijing

•Bid Opening Location: CECOM Conference Room, Block A, No. 17 Fuxing Road, Haidian District, Beijing

6. Contact Information

Tenderer: Hangzhou Jihai Semiconductor Co., Ltd.

7. Remittance Method

•Tender Agency Bank (RMB):

•Tender Agency Bank (USD):

•Account Number (RMB):

•Account Number (USD):