Wet wafer clean refers to the process of cleaning the surface of a semiconductor chip using a chemical solution. During semiconductor manufacturing, the surface of the chip is contaminated by various pollutants, such as organic matter, metal ions, particles, etc., which can negatively affect the performance and reliability of the chip. Therefore, before the next step of manufacturing, the chip surface needs to be cleaned to ensure manufacturing quality and reliability.

Wet wafer clean is a common cleaning method that uses a chemical solution to remove contaminants from the surface of the chip. Different chemical solutions can target different types of pollutants, so they need to be selected and adjusted according to the specific pollution situation. In the cleaning process, the chemical solution reacts with the surface of the chip to dissolve and wash away the pollutants, so as to achieve the cleaning effect.

Wet wafer clean has important application value in the field of semiconductor manufacturing, which can not only improve the performance and reliability of the chip, but also reduce the manufacturing cost and reduce the manufacturing time. By using the appropriate chemical solution and cleaning conditions, the chip surface can be cleaned with high precision and efficiency, and the damage and pollution caused to the chip surface during the cleaning process can be controlled.

It should be noted that Wet wafer clean is a highly technology-intensive cleaning method, which requires strict control of the type and concentration of chemical solution, cleaning time, cleaning temperature and other parameters to ensure the cleaning effect and surface quality. In addition, it is also necessary to carry out follow-up treatment processes such as dehydration and baking of the cleaned chip to further remove residual pollutants and improve the stability of the chip surface.